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1

VLSI reliability challenges: From device physics to wafer scale systems

Eiji Takeda, Kunihiko Ikuzaki, Hisao Katto, Yuzuru Ohji, Kenji Hinode, Akemi Hamada, Toshiyuki Sakuta, Takahiro Funabiki, Toshio Sasaki

Journal:

Microelectronics Reliability

Year:

1995

Language:

english

File:

PDF, 2.07 MB

english, 1995

2

Reliability issues of silicon LSIs facing 100-nm technology node

Eiji Takeda, Eiichi Murakami, Kazuyoshi Torii, Yutaka Okuyama, Eishi Ebe, Kenji Hinode, Shin'ichiro Kimura

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 634 KB

english, 2002

3

Copper-induced dielectric breakdown in silicon oxide deposited by plasma-enhanced chemical vapor deposition using trimethoxysilane

Takeda, Ken-ichi, Ryuzaki, Daisuke, Mine, Toshiyuki, Hinode, Kenji, Yoneyama, Ryo

Journal:

Journal of Applied Physics

Year:

2003

Language:

english

File:

PDF, 689 KB

english, 2003

4

Passivation effect of silicon nitride against copper diffusion

Miyazaki, Hiroshi, Kojima, Hisao, Hinode, Kenji

Journal:

Journal of Applied Physics

Year:

1997

Language:

english

File:

PDF, 431 KB

english, 1997

5

Heat and Moisture Resistance of Siloxane-Based Low-Dielectric-Constant Materials

Furusawa, Takeshi, Ryuzaki, Daisuke, Yoneyama, Ryo, Homma, Yoshio, Hinode, Kenji

Journal:

Journal of The Electrochemical Society

Year:

2001

Language:

english

File:

PDF, 399 KB

english, 2001

6

[ASCE STRESS INDUCED PHENOMENA IN METALLIZATION - Tokyo (Japan) (4-6 Jun 1997)] Fourth international workshop on stress induced phenomena in metallization - Whisker growth on aluminum thin films during heat treatment

Hinode, Kenji, Homma, Yoshio, Sasaki, Yasushi

Year:

1998

Language:

english

File:

PDF, 1.42 MB

english, 1998

7

Straightforward planarization method for multilayered SFQ device fabrication

Kenji Hinode, Shuichi Nagasawa, Masao Sugita, Tetsuro Satoh, Hiroyuki Akaike, Yoshihiro Kitagawa, Mutsuo Hidaka

Journal:

Physica C: Superconductivity

Year:

2004

Language:

english

File:

PDF, 447 KB

english, 2004

8

Fabrication of reliable via conductors for niobium SFQ devices

Kenji Hinode, Tetsuro Satoh, Shuichi Nagasawa, Yoshihiro Kitagawa, Mutsuo Hidaka

Journal:

Physica C: Superconductivity

Year:

2005

Language:

english

File:

PDF, 438 KB

english, 2005

9

Method for detailed evaluation of yield of Nb Josephson junctions

Kenji Hinode, Yoshihito Hashimoto, Yoshio Kameda, Tetsuro Satoh, Shinichi Yorozu, Shuichi Nagasawa, Mutsuo Hidaka

Journal:

Physica C: Superconductivity

Year:

2006

Language:

english

File:

PDF, 340 KB

english, 2006

10

Influence of smoking on osseointegrated implant failure: a meta-analysis

Daisuke Hinode, Shin-ichi Tanabe, Masaaki Yokoyama, Kenji Fujisawa, Eiji Yamauchi, Youji Miyamoto

Journal:

Clinical Oral Implants Research

Year:

2006

Language:

english

File:

PDF, 180 KB

english, 2006

11

Preparation of LiTiS intercalation compound by a solid state process

Takashi Uchida, Kenji Kohiro, Hirofumi Hinode, Masataka Wakihara, Masao Taniguchi

Journal:

Materials Research Bulletin

Year:

1987

Language:

english

File:

PDF, 445 KB

english, 1987

12

Design and Fabrication of Integrated Cryogenic Current Comparators

Maezawa, Masaaki, Urano, Chiharu, Maruyama, Michitaka, Yamada, Takahiro, Oe, Takehiko, Hidaka, Mutsuo, Satoh, Tetsuro, Nagasawa, Shuichi, Hinode, Kenji, Kiryu, Shogo, Kaneko, Nobu-hisa

Journal:

IEEE Transactions on Appiled Superconductivity

Year:

2011

Language:

english

File:

PDF, 1.35 MB

english, 2011

13

Resistivity Lowering of Palladium Silicide Film due to Post-Annealing

Kikuchi, Akira, Hinode, Kenji

Journal:

Japanese Journal of Applied Physics

Year:

1985

File:

PDF, 408 KB

1985

14

Whiskers grown on aluminum thin films during heat treatments

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1996

Language:

english

File:

PDF, 716 KB

english, 1996

15

Morphology-dependent oxidation behavior of reactively sputtered titanium–nitride films

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1997

Language:

english

File:

PDF, 697 KB

english, 1997

16

High-resolution temperature measurement of void dynamics induced by electromigration in aluminum metallization

Kondo, Seiichi, Hinode, Kenji

Journal:

Applied Physics Letters

Year:

1995

Language:

english

File:

PDF, 371 KB

english, 1995

17

Abnormal room-temperature oxidation of silicon in the presence of copper

Hinode, Kenji, Takeda, Ken’ichi, Kondo, Seiichi

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2002

Language:

english

File:

PDF, 894 KB

english, 2002

18

[IEEE 2008 International Solid-State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2008.02.3-2008.02.7)] 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers - Superconductive Single-Flux-Quantum Circuit/System Technology and 40Gb/s Switch System Demonstration

Hashimoto, Yoshihito, Nagasawa, Shuichi, Satoh, Tetsuro, Hinode, Kenji, Suzuki, Hideo, Miyazaki, Toshiyuki, Hidaka, Mutsuo, Yoshikawa, Nobuyuki, Terai, Hirotaka, Fujimaki, Akira

Year:

2008

Language:

english

File:

PDF, 988 KB

english, 2008

19

Dependence of electromigration damage on current density

Hinode, Kenji, Furusawa, Takeshi, Homma, Yoshio

Journal:

Journal of Applied Physics

Year:

1993

Language:

english

File:

PDF, 1022 KB

english, 1993

20

Thermographic analysis of electromigration phenomena in aluminum metallization

Kondo, Seiichi, Ogasawara, Koutaro, Hinode, Kenji

Journal:

Journal of Applied Physics

Year:

1996

Language:

english

File:

PDF, 894 KB

english, 1996

21

Effects of grain size and preferred orientation on the electromigration lifetime of Al-based layered metallization

Kondo, Seiichi, Deguchi, Osamu, Hinode, Kenji

Journal:

Journal of Applied Physics

Year:

1995

Language:

english

File:

PDF, 1004 KB

english, 1995

22

Direct Resist Removal Process from Copper-Exposed Vias for Low-Parasitic-Capacitance Interconnects

Furusawa, Takeshi, Sakuma, Noriyuki, Ryuzaki, Daisuke, Kondo, Seiichi, Takeda, Ken-ichi, Machida, Shuntaro, Yoneyama, Ryo, Hinode, Kenji

Journal:

Journal of The Electrochemical Society

Year:

2001

Language:

english

File:

PDF, 882 KB

english, 2001

23

Oxygen Plasma Resistance of Low-k Organosilica Glass Films

Furusawa, Takeshi, Ryuzaki, Daisuke, Yoneyama, Ryo, Homma, Yoshio, Hinode, Kenji

Journal:

Electrochemical and Solid-State Letters

Year:

2001

Language:

english

File:

PDF, 506 KB

english, 2001

24

Fabrication of Superconducting Qubits with Al Trilayer Josephson Junctions

Satoh, Tetsuro, Noguchi, Y., Yamagishi, M., Nagasawa, Shuichi, Hinode, Kenji, Hidaka, Mutsuo, Maezawa, Masaaki, Horikawa, T.

Journal:

IEEE Transactions on Appiled Superconductivity

Year:

2014

Language:

english

File:

PDF, 630 KB

english, 2014

25

Resistivity Increase in Ultrafine-Line Copper Conductor for ULSIs

Hinode, Kenji, Hanaoka, Yuko, Takeda, Ken-ichi, Kondo, Seiichi

Journal:

Japanese Journal of Applied Physics

Year:

2001

Language:

english

File:

PDF, 483 KB

english, 2001

26

[ACM Press the 2nd international conference - Orlando, Florida, United States (1997.01.06-1997.01.09)] Proceedings of the 2nd international conference on Intelligent user interfaces - IUI '97 - A response model for a CG character based on timing of interactions in a multimodal human interface

Sakamoto, Kenji, Hinode, Haruo, Watanuki, Keiko, Seki, Susumu, Kiyama, Jiro, Togawa, Fumio

Year:

1997

Language:

english

File:

PDF, 484 KB

english, 1997

27

Light Emission Analysis of Dielectric Breakdown in Stressed Damascene Copper Interconnection

Takeda, Ken-ichi, Hinode, Kenji, Noguchi, Junji, Yamaguchi, Hizuru

Journal:

Japanese Journal of Applied Physics

Year:

2001

Language:

english

File:

PDF, 878 KB

english, 2001

28

Variable-Energy Positron Studies of Vacancy-Type Defects in TiN Films on Si

Wei, Long, Dosho, Chisei, Cho, Yang-koo, Tanigawa, Shoichiro, Hinode, Kenji

Journal:

Japanese Journal of Applied Physics

Year:

1990

File:

PDF, 507 KB

1990

29

Design of all-dc-powered high-speed single flux quantum random access memory based on a pipeline structure for memory cell arrays

Nagasawa, Shuichi, Hinode, Kenji, Satoh, Tetsuro, Kitagawa, Yoshihiro, Hidaka, Mutsuo

Journal:

Superconductor Science and Technology

Year:

2006

Language:

english

File:

PDF, 256 KB

english, 2006

30

[IEEE 2015 15th International Superconductive Electronics Conference (ISEC) - Nagoya, Japan (2015.7.6-2015.7.9)] 2015 15th International Superconductive Electronics Conference (ISEC) - Defects of Nb/AlOx/Nb Josephson Junctions Caused by Underneath Fine Particles

Hidaka, Mutsuo, Nagasawa, Shuichi, Satoh, Tetsuro, Hinode, Kenji

Year:

2015

Language:

english

File:

PDF, 704 KB

english, 2015

31

An Isochronal Annealing Study of Deformed Copper by Means of Positron Lifetime

Hinode, Kenji, Tanigawa, Shoichiro, Doyama, Masao

Journal:

Journal of the Physical Society of Japan

Year:

1977

File:

PDF, 331 KB

1977

32

Positron Lifetimes in Deformed Copper

Hinode, Kenji, Tanigawa, Shoichiro, Doyama, Masao

Journal:

Journal of the Physical Society of Japan

Year:

1976

File:

PDF, 726 KB

1976

33

Nb 9-Layer Fabrication Process for Superconducting Large-Scale SFQ Circuits and Its Process Evaluation

NAGASAWA, Shuichi, HINODE, Kenji, SATOH, Tetsuro, HIDAKA, Mutsuo, AKAIKE, Hiroyuki, FUJIMAKI, Akira, YOSHIKAWA, Nobuyuki, TAKAGI, Kazuyoshi, TAKAGI, Naofumi

Journal:

IEICE Transactions on Electronics

Year:

2014

Language:

english

File:

PDF, 5.33 MB

english, 2014

34

Materials-Related Issues for Cu Interconnects Used in Ultra High Speed Large Scaled Integrated Si Devices. Increase in Electrical Resistivity of Copper and Aluminum Fine Lines.

Hanaoka, Yuko, Hinode, Kenji, Takeda, Ken’ichi, Kodama, Daisuke

Journal:

MATERIALS TRANSACTIONS

Year:

2002

Language:

english

File:

PDF, 121 KB

english, 2002

35

Electromigration in LSI Aluminum Metallization.

Journal:

Year:

1997

File:

PDF, 1.93 MB

1997

36

Aluminum conductor materials for silicon LSI.

Journal:

Bulletin of the Japan Institute of Metals

Year:

1989

File:

PDF, 12.64 MB

1989

37

Some critical issues of LSI aluminum conductor.

Journal:

Journal of Japan Institute of Light Metals

Year:

1991

File:

PDF, 1.80 MB

1991

38

Whiskers formed on aluminum electrodes and conductors in electronic devices.

Journal:

Journal of Japan Institute of Light Metals

Year:

1998

File:

PDF, 1.25 MB

1998

39

Positron Lifetime Study of Neutron-Irradiated Molybdenum

Hinode, Kenji, Tanigawa, Shoichiro, Kumakura, Hiroaki, Doyama, Masao, Shiraishi, Kensuke

Journal:

Journal of the Physical Society of Japan

Year:

1978

File:

PDF, 1.14 MB

1978

40

Relationship between Subjective Oral Health Status and Lifestyle in Elderly People: A Cross-Sectional Study in Japan

Yoshioka, Masami, Hinode, Daisuke, Yokoyama, Masaaki, Fujiwara, Aiichiro, Sakaida, Yasuhiko, Toyoshima, Kenji

Journal:

Year:

2013

Language:

english

File:

PDF, 1.04 MB

english, 2013

41

[AIP Stress-induced phenomena in metallization: Second international workshop - Austin, Texas (USA) (29â31 Mar 1993)] AIP Conference Proceedings - Role of evolved stress in electromigration degradation

Hinode, Kenji, Furusawa, Takeshi, Homma, Yoshio

Year:

1994

File:

PDF, 1.41 MB

1994

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